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Decreases new product time-to-market |
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- Reduces design respins and associated manufacturing/test costs and time |
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Reduces ESD field failures |
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- Reduces product returns and replacements - Eliminates corresponding RMA logistics, management and failure analysis |
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Eliminates discrete surge suppressors/protection circuits |
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- Reclaims board real estate - Eliminates corresponding inventory and management |
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Simplifies routing, component placement, traces and vias |
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Can potentially eliminate port covers or other special ESD isolation features |
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Reduces cross-talk and soft errors |
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Increases fab throughput and capacity |
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May eventually reduce on-chip ESD protection circuits and increase signal integrity |
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Increases product uptime, availability and overall reliability |
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Increases brand awareness and value |