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COMPANY: Technical Advisory Board

Maniam Alagaratnam - Chuck Anderson - Steven A. Boggs - George Dudnikov - Yuthana Hemungkorn - Thomas J. McCarthy - Mike Rubino - Joan K. Vrtis - Alex Zettl - Michael Cornwell - Anders Franzen

Maniam Alagaratnam

Vice President, Package Development R&D
and Assembly Engineering, LSI Logic

Mr. Alagaratnam joined LSI Logic Corporation in 1990 and was promoted to Vice President of Package Development R&D in 1996. An eminent leader in the area of semiconductor IC packaging, during the past 20 years Mr. Alagaratnam has been instrumental in establishing assembly infrastructures throughout the industry. He has developed key process and materials technologies specifically for flip chip on laminate packaging and low-k silicon packaging technologies. Mr. Alagaratnam launched his career in semiconductor packaging and assembly at National Semiconductor in Singapore and thereafter, managed manufacturing operations with National Semiconductor in Indonesia and Malaysia. Mr. Alagaratnam has published several papers and holds 30 patents related to semiconductor packaging. He was recognized as the Technologist of the Year by MEPTEC (1998). Mr. Alagaratnam received his BS in electrical and electronic engineering from Hendon College pf Advanced Technology in England.

Chuck Anderson

Corporate Vice President, Advanced Micro Devices

Mr. Anderson joined AMD in 1981 and currently holds the position of Corporate Vice President of Manufacturing Services. He is responsible for all packaging engineering, assembly, and test operations at the company. During Mr. Anderson’s 26 year tenure at AMD, he has held various engineering and operations positions ranging from Manager of Automation and Director of Engineering to his current position as head of global operations. Prior to joining AMD, Mr. Anderson focused on assembly automation and ceramic dual in-line package (CERDIP) technology at Fairchild Semiconductor. Previously, Mr. Anderson worked for National Semiconductor where he ramped a quartz crystal assembly and test process in Bangkok, launching him fully into Asia manufacturing. Mr. Anderson holds a BS and MS in Mechanical Engineering from UC Davis.

Steven A. Boggs

Director EIRC and Research Professor of Materials Science
Physics and Electrical Engineering, University of Connecticut

Dr. Boggs is Director of the Electrical Insulation Research Center (EIRC) at the University of Connecticut where his work ranges from monitoring systems for Con Edison’s substations to the fundamental investigations of high field phenomena in dielectrics, capacitor technology and power engineering. He is also an Adjunct Professor of Electrical Engineering at the University of Toronto where his work focused on development of programs for transient nonlinear finite element analysis and the application thereof to the study of high field phenomena in solid dielectrics. Prior to these positions, Dr. Boggs spent six years as Director of Engineering and Research for Underground Systems, Inc. and Vice President of its subsidiary, Chicago Condenser Corporation. During this period, he patented the design for the first high temperature superconducting power cable that was adopted by Pirelli and American Superconductor for their first generation cable. Dr. Boggs also wrote software used for high voltage capacitor designs and possesses an in-depth knowledge of both high voltage polymer film capacitor design and manufacturing technology. His previous position with the research division of Ontario Hydro focused on electrical failure mechanisms in solid dielectrics, gaseous dielectrics, and diagnostics (such as partial discharge). Dr. Boggs has authored nearly 200 papers in the fields of partial discharge measurement, high frequency phenomena in power apparatus, high field phenomena in solid dielectrics, and SF6 insulated systems. He was elected a Fellow of the IEEE for his contributions to the field of SF6 gas insulated substation technology. Dr. Boggs received his BA in Physics from Reed College and his PhD in Chemical Physics (molecular spectroscopy) and MBA degrees from the University of Toronto.

George Dudnikov

Senior Vice President and Chief Technology Officer, Sanmina-SCI

Mr. Dudnikov joined Sanmina-SCI in 1997 and currently holds the position of Senior Vice President and Chief Technology Officer for the Printed Circuit Board and Backplane Division. He is responsible for global Process and Product Engineering along with setting the division’s technical direction and strategy. His responsibilities also include R&D, Intellectual Property management and licensing, Quality and Product Assurance, and Lean Manufacturing at this top tier EMS provider. Mr. Dudnikov has over 28 years experience in engineering and operations management. Prior to joining Sanmina-SCI, he was Vice President of Global Operations for Elexsys International. Previously, he held executive positions at Northern Telecom and Hadco. Mr. Dudnikov has published numerous technical papers and is a frequent speaker and panelist at industry technical conferences. He is the holder of several patents all in the area of advanced electronics. Mr. Dudnikov holds a BS in Mechanical Engineering from Columbia University.

Yuthana Hemungkorn

Vice President, Spansion (Thailand) Limited

Mr. Hemungkorn joined Spansion in 1993 as Vice President of Spansion Thailand, Ltd. Prior to joining Spansion, Mr. Hemungkorn was Vice President of South East Asia Operations at Dynacraft International. Mr. Hemungkorn worked at National Semiconductor as Operations Manager of their Wafer Bump Fabrication facilities in Santa Clara (Logic) and Malaysia. Previously, Mr. Hemungkorn was Managing Director of Dynacraft Singapore. Mr. Hemungkorn also held the positions of Operations Manager at National Semiconductor, Thailand and Purchasing Manager at National Semiconductor, Santa Clara. Mr. Hemungkorn began his career at Ford Motor Company as Sales Manager (Thailand) after completing their management trainee program. Mr. Hemungkorn served as President of the Electronics and Computer Employers Association of Thailand from 2001-2003. In Thailand, he has served on the Nonthaburi Police Board, Human Resources Development for Investment Promotion, and Provincial Wages committees. Mr. Hemungkorn also serves as guest speaker at several management and technology organizations. He was honored with Thailand’s Industry Ministry Prime Minister’s awards for Safety (1996), for Quality Systems (1997), for Productivity Improvement (1998) and for Environmental Management (1998). Mr. Hemungkorn was awarded the Best Employer for Labor Welfare (1997), Best Employer for Women and Child Protection for Export Promotion (2000-2003) and Best Employers in Asia Award in 2001 and 2005. Mr. Hemungkorn received his BS in electrical engineering from New South Wales University in Sydney, Australia and completed the Executive Program at Stanford University and the National University of Singapore.

Thomas J. McCarthy

Professor of Polymer Science and Engineering
University of Massachusetts Amherst

Dr. McCarthy is a Professor in the Polymer Science and Engineering Department at the University of Massachusetts, Amherst where he served as Department Head from 2000-2003. Dr. McCarthy has been a faculty member at the University of Massachusetts Amherst since 1982. His research interests extend to numerous areas of polymer surface and interface science, metal and metal oxide surface chemistry, polymers and supercritical fluids, polymers and ionic liquids, nanoscopic polymer objects, and ultrathin conformal coatings. Dr. McCarthy holds numerous honors and distinctions including the ACS Colloids and Surfaces Division Langmuir award (2006), the University of Massachusetts Milestone award (2006) and the Conti Faculty award (2000), and the Arthur K. Doolittle award (1996). Dr. McCarthy has served on the editorial advisory board for Macromolecules, Langmuir, Heteroatom Chemistry, and the Journal of Applied Polymer Science. He is a member of the international advisory board for the ACS Polymer Surfaces and Interfaces Series. Dr. McCarthy is Director of the National Science Foundation’s Research Site for Educators in Chemistry and Director of the University of Massachusetts Institute for Interface Science. Dr. McCarthy has authored 124 papers and holds 8 patents. Dr. McCarthy received his BS in chemistry from the University of Massachusetts Amherst and his PhD in organic chemistry from the Massachusetts Institute of Technology.

Mike Rubino

Vice President of Engineering, SMART Modular Technologies

Mr. Rubino joined SMART Modular Technologies in 1999 and currently holds the position of Vice President of Engineering. In this capacity, he is responsible for all memory product design, test development, documentation control, new product introduction, failure analysis, customer solution definition, BOM engineering, and new technology evaluation. He has 22 years of engineering, program and design management experience primarily in the computer memory market. Prior to joining SMART Modular, Mr. Rubino gained extensive career development and engineering experience at IBM, Burroughs Corporation, Schenck Trevel Corporation, and Grumman Aerospace. Mr. Rubino holds a BS in electrical engineering from the Rochester Institute of Technology and an MS in electrical engineering from Syracuse University.

Joan K. Vrtis

President and Chief Executive Officer, Kemeta

Dr. Vrtis is President and Chief Executive Officer of Kemeta and co-owner of FlipChip International, a leading provider of wafer level packaging and flip chip bumping services, where she currently maintains an advisory role. Prior to founding Kemeta, Dr. Vrtis was co-owner and Chief Technology Officer of RoseStreet Labs. Prior to joining RoseStreet Labs, Dr. Vrtis formed eKubik Consulting, specializing in engineering and commercialization methodologies and advancement. Dr. Vrtis spent eight years at Intel Corporation heading several packaging development groups for the Pentium and Itanium product lines. Dr. Vrtis has been awarded several patents. She holds a BS in chemistry from the University of Illinois, Chicago and an MS in polymer engineering, an MS in metallurgy and materials, and a PhD in polymer engineering and science, all from the University of Massachusetts Amherst. Dr. Vrtis also holds an MBA from DePaul University.

Alex Zettl

Professor of Physics, UC Berkeley and Faculty Scientist at
Lawrence Berkeley National Laboratories

Dr. Zettl joined the Berkeley physics faculty in 1983, where he is presently Professor of Physics. At Berkeley he directs the Center of Integrated Nanomechanical Systems. He is also a Senior Scientist at the Lawrence Berkeley National Laboratory. Dr. Zettl"s research interests include the electronic, thermal, and mechanical properties of low-dimensional and nanoscale materials, including superconductors, fullerenes, nanotubes, and graphene. He is expert in the synthesis, characterization, and device application of carbon and BCN nanstructures, and has made key advances using microscopy tools including in-situ TEM nanomanipulation, AFM, SEM, and STM. Dr. Zettl holds numerous patents and has been awarded materials and technology prizes including an R&D 100 award (2004) and the James C. McGroddy Prize for New Materials (2006). He is a Fellow of the American Physical Society. Dr. Zettl received his A.B. from UC Berkeley and his PhD in experimental solid state physics from UCLA.

Michael Cornwell

Global Director of Standard and Technology, IDEMA

Mr. Cornwell was the Lead Technologist for flash memory at Sun Microsystems where he was responsible for creating NAND flash memory technology for the Server and Enterprise applications. Prior to his time at Sun, Mr. Cornwell was the Manager of Storage Engineering for the iPod Division of Apple Inc. In his role, he was instrumental in the adoption of NAND flash in Apple products including iPod and iPhone. Mr. Cornwell was also the Storage Architect for Quantum Corporation focusing on storage management, virtual tape and disk-based back up technologies. Mr. Cornwell holds a Bachelor's degree in Computer Science from the University of California at Santa Cruz and holds 15 patents in storage technologies.

Anders Franzen

Vice President & Chief Operating Officer, Nederman

Mr. Franzen is Vice President & Chief Operating Officer at Nederman, a global company in industrial air filtration, based in Helsingborg, Sweden. Prior to joining Nederman, Mr. Franzen served as Chief Operating Officer at Wavecom S.A. initially based in North Carolina, USA, 2006-2008 and later in Paris, France, 2008-2009. Previously Mr. Franzen was Corporate VP and Head of Business Unit M2M in Sony Ericsson based in London U.K. and North Carolina, USA from 2001-2006 and before that Corporate VP and head of Global Sourcing for Ericsson Consumer Products based in London, U.K., from 2000-2001. Before joining the telecoms industry, Mr. Franzen held senior positions at Ford Motor Company/Premier Automotive Group in London, U.K., 1999-2000 and at Volvo Car Corporation in Gothenburg and Helmond, Netherlands, from 1993-1999.


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